Electronic Materials
- Epoxy Molding Compound
- Clear Epoxy Molding Compound
- Functional Dispersions
- Liquid Resin Materials
- Trimethyl Indium (TMI)
- Trimethy Aluminum (Tmal)
- Unsaturated Polyester Molding compound
Main products
- From upstream of LD epitaxy to downstream of thermosetting material are be used for LED applications.
- Pressure sensitive adhesive, hot-melt adhesive, antistatic agent and functional painting that can be applied within film maker or relevant industries.
Encapsulation of Electronic Components
- Epoxy Molding Compound
- Clear Epoxy Molding Compound
- Liquid Resin Materials
- Unsaturated Polyester
Epitaxial applications of oriented metal
- Trimethyl Indium (TMIn)
- Trimethy Aluminum (Tma)
Coating liquid
-
Functional Dispersions
Partner
